A greater variety of small surface-mount devices (SMDs) are being developed successively. As fifth-generation (5G) mobile communications system starts full implementation, demands for ultrasmall and thin chips for use in smartphones, modules, and internet of things (IoT) products have been becoming prominent. Also, shapes of high-reliability chips for automobiles and industrial equipment have also been increasing in variety. SMDs continue to evolve in line with technological trends of growth fields. Downsizing Technologies

The miniaturization of main chip components, like multilayer ceramic capacitors (MLCCs), inductors and resistors, have continued, and at present, the ratio of 1005-size products is the highest. However, 0603- and 0402-sizes have rapidly expanded their markets reflecting the increasing mounting density of components in smartphones, wearable terminals, and various modules. The Japan Electronics and Information Technology Industries Association (JEITA) predicts that the percentage of 0603-size products will become the highest, replacing 1005-size.