W ith the progress of surface-mount technologies (SMT) as backdrop, technologies for chip components or surface-mount devices (SMDs) have been advancing remarkably. The growing needs for high-density mounting of fifth-generation (5G) communications-compatible smartphones and internet of things (IoT) terminals, as well as electronic control units (ECUs) and various modules in vehicles, accelerate the downsizing and functional enhancement of SMDs.

The pandemic caused by the novel coronavirus disease (COVID-19) restricted companies' business activities. However, since summer, manufacturers restarted their production activities on full scale. With these moves, the production of various electronic devices, manufacturing equipment and automobiles has been revitalized.