Renesas Electronics Corporation and German fabless semiconductor company 3db Access AG have collaborated to bring secure access solutions to the connected smart home, internet of things (IoT), Industry 4.0, mobile computing, and connected vehicle applications. The collaboration aims to combine each company's technical expertise to deliver breakthrough multi-receiver ultra wideband (UWB) solutions to the global market.

Renesas is augmenting its microcontrollers (MCUs) and RF connectivity capabilities with 3db Access' field proven secure ranging UWB chips, which are designed for use in smartphones, smart watches, automobiles, and other IoT applications. This will accelerate a roadmap of ICs and modules that leverage both companies' strengths and product portfolios to bring best-in-class UWB solutions to market.

The collaboration also gives Renesas customers access to advanced UWB solutions that are IEEE 802.15.4z dual HRP/LRP-compliant and make use of an RF architecture that achieves ten times lower power consumption. 3db devices also provide the smallest UWB silicon area compared to competitive ICs.

Dr. Amit Bavisi, Vice President of Engineering, IoT and Infrastructure Business Unit at Renesas said, "We believe that our combined technical expertise, differentiated IP, and global operations will allow us to design the smallest and highest performance system solutions that provide secure distance ranging access to our customers' next-generation products." Meanwhile, Dr. Boris Danev, Chief Executive Officer of 3db Access said "The combination of 3db Access' UWB domain knowledge and positioning products fits perfectly with Renesas' embedded system processing and global market expertise."

Both companies are discussing terms of business engagement that will enable 3db Access to develop new UWB solutions for every market space, in addition to bringing existing UWB solutions to the Renesas portfolio.